Mechanical characterization of C60whiskers by MEMS bend testing

Polysilicon MEMS fatigue and fracture characterization via on chip testing

In order to characterize the fatigue behaviour and determine the fracture energy of polysilicon used in micro-systems, an on-chip testing device has been designed and fabricated. The experimental set-up is able to continuously measure the elastic stiffness decrease and therefore to evidence fatigue of polysilicon 15-μm thick films and to allow for the introduction of a sharp crack at the notch ...

Mechanical Properties of Mems Structures

The Membrane Deflection Experiment was used to test the mechanical response of freestanding thin film gold specimens. We present stress-strain curves obtained on films 0.3, 0.5, and 0.1 μm thick. Elastic modulus was consistently measured in the range of 53–55 GPa. Several size effects on the mechanical properties were observed including yield stress variations with membrane width and film thick...

Development of MEMS Testing Methodology

Microelectromechanical systems (MEMS) are miniature electromechanical sensor and actuator systems developed from the mature batch-fabricated processes of VLSI technologies. Projected growth in the MEMS market requires significant advances in CAD and manufacturing for MEMS. These advances must be accompanied with testing methodologies that ensure both high quality and reliability. Effectiveness ...

Micro - Electro - Mechanical - Systems ( Mems )

In-situ MEMS Testing

Related to the dramatically smaller volume of microelectromecanical systems (MEMS), new methods in testing and qualification are needed. On single crystal silicon (SCSi) based devices, stress and loading in operation introduces defects during the MEMS life time and increases the risk of failure. Reliability studies on potential failure sources have an impact on MEMS design and are essential to ...